2.4 W/mK AG Thermopad without Glue 30x30x0.5 mm
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AG Thermopads without glue are used where the use of paste is not possible
thermally conductive. They are very flexible. They are characterized by high compressibility which ensures
good fit for elements that require cooling. They do not contain glue.
Application:
- between heat-generating semiconductors and a heat sink
- filling the air spaces between the computer motherboard and the heat sink
- in LED lighting systems
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Manufacturer
Product code
GL.AGT.303
Dimensions
30x30 mm
Thermoconductivity
2.4 W/mK
Thickness
0.5 mm
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