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3.1 W/mK Copper Thermal Grease Heat Conductive Copper Paste 40g Syringe

3.1 W/mK Copper Thermal Grease Heat Conductive Copper Paste 40g Syringe
14,95 €
/ pc
Easy return of this product within 14 days from the date of purchase for any reason
Free delivery for orders over 85,00 €

Heat conductive copper paste is designed to fill joints between a processor and its radiator to improve cooling.. Thermal conductivity ~ 3,1 W/mK.

Copper-based heat conducting paste filling the processor-radiator connections to improve cooling. Thermal conductivity ~ 3.1 W/mK.

Does not conduct electricity

Application:

  • filling the processor-radiator connections
  • not suitable for aluminum radiators
To download
Manufacturer
Product code
GL.AGT.061
Thermoconductivity
3.1 W/mK
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