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6.0 W/mK AG Thermopad without Glue 20x130x0.5 mm

6.0 W/mK AG Thermopad without Glue 20x130x0.5 mm
5,58 €
/ pc
Easy return of this product within 14 days from the date of purchase for any reason
Free delivery for orders over 85,00 €

AG Thermopads without glue are used where the use of paste is not possible
thermally conductive. They are very flexible. They are characterized by high compressibility which ensures
good fit for elements that require cooling. They do not contain glue.

Application:

- between heat-generating semiconductors and a heat sink
- filling the air spaces between the computer motherboard and the heat sink
- in LED lighting systems

To download
Manufacturer
Product code
GL.AGT.305
Dimensions
20x130 mm
Thermoconductivity
6.0 W/mK
Thickness
0.5 mm
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