Easy Print NO CLEAN Low Temperature Solder Paste Sn62/Pb36/Ag2 - 1.4ml Syringe

Easy Print Sn62Pb36Ag2, a ‘No Clean’ type paste is designed for soldering SMD components in production processes that do not include washing phase. Apart from metals powders, the product composition includes resin based and solvent based flux, activators that remove oxides and thixotropic additions, responsible for viscosity and plasticity. The paste does not lose its physical and chemical properties even after being left for 20 hours on the PCB. This time depends on conditions in room: humidity and temperature.

No Clean Soldering Paste

Sn62Pb36Ag2

Paste for soldering of surface-mounted (SMD) components

Advantages:

• Resistant to solderballing ( mid chip solderballing )
• Good adhesion to components for over 24hrs after application
• Exhibits long stencil life even for 8hrs of continuous printing, prolonged usability ( stencil life )
• Low level of colorless, non-corrosive soldering residues ( no clean ), that are flexible enough to allow
• penetration of tester needles
• Fine pitch
• Printing with squeegee speed up to 150mm/s