Solder Wire Sn99.3Cu0.7 1.1.3/3.0% Ø0.50 100g

Lead-free solder wire with flux, universal use in electronics and electrical engineering.

Alloy designation according to ISO 9453: 2014:
Sn99.3Cu0.7 (401)
Product form: wire with flux
Name of the flux: 1.1.3

General characteristics
The Sn99.3Cu0.7 solder tin with 1.1.3 flux was produced in the first smelting of tin and copper in accordance with EN ISO 9453: 2014. The halogen-free, rosin-free flux 1.1.3 is intended for manual and automatic soft soldering. The binder with flux meets the requirements of the RoHS2 directive.

Alloy composition [%]
Sn - rest
Cu - 0.5 - 0.9
Bi - max 0.1
Sb - max 0.1
Ag - max 0.1
Cd - max 0.002
Au - max 0.05
In - max 0.1
Pb - max 0.07
Al - max 0.001
As - max 0.03
Fe - max 0.02
Ni - max 0.01
Zn - max 0.001

Physical Characteristics
Melting point (solidus / liquidus) 227 ° C
Specific gravity 7.31 g / cm3
Resistivity 0.126 μΩ • m
Thermal conductivity 66 W / m • K
Tensile strength at break 300 kgf / cm2
Elongation at break 21%
Hardness 9 HB
Recommended soldering tip temperature 340 - 420°C

1.1.3 Flux
designation according to DIN 8511: SW32
designation according to ISO 9454: 1.1.3B
designation according to J-STD-004: ROM0
Flux content: 3.0 +/- 0.2%
Halogen content: 0.0%
Acid value: 195 ± 10 mg KOH / g
Corrosivity: non-corrosive

Manufacturer: Cynel Unipress
Manufactured in Poland