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Solder Wire Sn99.3Cu0.7 SW26/2.2% Ø1.00 14g Vial

Solder Wire Sn99.3Cu0.7 SW26/2.2% Ø1.00 14g Vial
Solder Wire Sn99.3Cu0.7 SW26/2.2% Ø1.00 14g Vial
Solder Wire Sn99.3Cu0.7 SW26/2.2% Ø1.00 14g Vial
Solder Wire Sn99.3Cu0.7 SW26/2.2% Ø1.00 14g Vial
Solder Wire Sn99.3Cu0.7 SW26/2.2% Ø1.00 14g Vial
Solder Wire Sn99.3Cu0.7 SW26/2.2% Ø1.00 14g Vial
2,15 €
/ pc
Easy return of this product within 14 days from the date of purchase for any reason

The most popular solder wire with flux, for home & professional use.
Ideal for all electronics, phone, computer, laptop repairs. Workshops welcome!

This product is brand new.

For larger volumes ask for discounts and delivery options.

Alloy designation according to ISO 9453: 2014:
Sn99.3Cu0.7 (401)
Product form: wire with flux
Flux name: SW26

General characteristics
Lead-free solder Sn99.3Cu0.7 is produced by Cynel-Unipress in the first smelting of tin and copper. Its chemical composition complies with the ISO 9453: 2014 standard. The Sn99.3Cu0.7 alloy is the most cost effective alternative to lead-containing solders. It does not contain silver. The alloy is designed for soldering in lead-free technology. RoHS compliant. It can be used by professionals as well as private individuals outside of professional use.

Alloy composition - mass fraction in %
Sn - rest
Cu - 0.5 - 0.9
Bi - 0.1
Sb - 0.1
Ag - 0.1
Cd - 0.002
Au - 0.05
In - 0.1
Pb - 0.07
Al - 0.001
As - 0.03
Fe - 0.02
Ni - 0.01
Zn - 0.001

Physical Characteristics
Melting point (solidus / liquidus) 227 ° C (eutectic alloy)
Specific gravity 7.31 g / cm3
Resistivity 0.126 μΩ • m
Thermal conductivity 66 W / m • K
Tensile strength at break 300 kg / cm2
Elongation at break 21%
Hardness 9 HB
Recommended tip temperature for soldering 320 - 360 ° C (for nickel-plated elements up to 400 ° C)

SW26 flux
Halide flux based on modified rosin. Provides very good solderability in popular applications in all industries, as well as in hobby applications. The flux works on most metal surfaces, except aluminum, its alloys and stainless steel. Soldering flux residues do not need to be removed and can remain on the brazed surface. Alcohol-based solvents are recommended for washing off the residues.

designation according to DIN 8511: SW26
designation according to ISO 9454-1: 1.1.2
designation according to J-STD-004: ROL1
Standard flux content: 2.2% ± 0.2%
Halide content: 0.5%
Acid value: 180 mg KOH / g
Copper mirror test: meets (in accordance with J-STD-004 IPC-TM-650 2.3.32D)
Corrosivity: non-corrosive

Manufacturer: Cynel Unipress
Manufactured in Poland

Manufacturer
Product code
GL.000.153
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