Solder Wire Sn99Cu0.7Ag0.3 1.1.3/3.0% Ø0.50 100g

Low-silver (LOW-SAC) lead-free solder wire for soldering applications in soldering units.

Alloy designation according to ISO 9453: 2014:
Sn99Cu0.7Ag0.3 (501)
Product form: wire with flux
Name of the flux: 1.1.3

General characteristics
The Sn99Cu0.7Ag0.3 solder wire with 1.1.3 flux was produced in the first smelting of tin, copper and silver in accordance with EN ISO 9453: 2014. The halogen-free, rosin-free flux 1.1.3 is intended for manual and automatic soft soldering. The low-silver binder is intended for professional mechanized soldering in electronics, where compliance with the RoHS2 directive is required.

Alloy composition [%]
Sn - rest
Ag - 0.20 - 0.40
Cu - 0.50 - 0.90
Bi - max 0.06
Sb - max 0.10
Cd - max 0.002
Au - max 0.05
In - max 0.10
Pb - max 0.07
Al - max 0.001
As - max 0.03
Fe - max 0.02
Ni - max 0.01
Zn - max 0.001

Physical Characteristics
Melting point (solidus / liquidus) 217/227 ° C
Specific gravity 7.33 g / cm3
Resistivity -
Thermal conductivity -
Tensile strength at break 300 kgf / cm2
Elongation at break 22%
Hardness 14 HB
Recommended soldering tip temperature 340 - 420 ° C

1.1.3 Flux
designation according to DIN 8511: SW32
designation according to ISO 9454: 1.1.3B
designation according to J-STD-004: ROM0
Flux content: 3.0 +/- 0.2% others to be agreed
Halogen content: 0.0%
Acid value: 195 ± 10 mg KOH / g
Corrosivity: non-corrosive

Manufacturer: Cynel Unipress
Manufactured in Poland