3.1 W/mK Copper Thermal Grease Heat Conductive Copper Paste 1.5ml Syringe
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Heat conductive copper paste is designed to fill joints between a processor and its radiator to improve cooling.. Thermal conductivity ~ 3,1 W/mK.
Copper-based heat conducting paste filling the processor-radiator connections to improve cooling. Thermal conductivity ~ 3.1 W/mK.
Does not conduct electricity
Application:
- filling the processor-radiator connections
- not suitable for aluminum heat sinks - use AG Extreme, AG Silver or AG Gold instead.
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