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3.1 W/mK Copper Thermal Grease Heat Conductive Copper Paste 1.5ml Syringe

3.1 W/mK Copper Thermal Grease Heat Conductive Copper Paste 1.5ml Syringe
Package:
1.5 ml Syringe
4,97 €
/ pc
Easy return of this product within 14 days from the date of purchase for any reason
This product is not available for collection

Heat conductive copper paste is designed to fill joints between a processor and its radiator to improve cooling.. Thermal conductivity ~ 3,1 W/mK.

Copper-based heat conducting paste filling the processor-radiator connections to improve cooling. Thermal conductivity ~ 3.1 W/mK.

Does not conduct electricity

Application:

  • filling the processor-radiator connections
  • not suitable for aluminum heat sinks - use AG Extreme, AG Silver or AG Gold instead.

 

To download
Manufacturer
Product code
GL.AGT.060
Package
1.5 ml Syringe
Thermoconductivity
3.1 W/mK
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